Huawei has disclosed a patent for chip stack packaging and terminal equipment

Huawei has disclosed a patent for chip stack packaging and terminal equipment to solve the problem of high cost caused by the use of through-silicon via technology.
HUAWEI
The patent abstract shows that this is a chip stacking package and terminal equipment, involving the field of semiconductor technology, which can solve the problem of high cost caused by the use of through-silicon via technology while ensuring the power supply demand.HUAWEI

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